- Form factor: rackmount case
- Perfect balance of performance and mobility
- Rugged design with Mil-Std compliance environment and EMC standards
- Super easy to use robust hardware
- Separate remote available / Master Slave setup with the same software setup
- Optional 19 inch rack for fixed setup
- Optional Win 10 computer program available
- UTP communication bus Echogram common protocol
- Unit can process data bus via RS232, RS485 and NMEA 2000, NMEA 0183
The COM is thermally coupled to the top surface of the enclosure with a conduction cooling heat spreader and mounting plate. (Heat spreader removed for illustration purposes, normally present in the open rectangle in the mounting plate).
The optional filtered 80-watt power supply is thermally coupled to the bottom surface of the enclosure using a conduction cooling mounting plate with thermal pads on both sides.
SPU is based on Express carrier board featuring a high level of I/O as well as multiple sockets for I/O expansion. The optional integrated data acquisition circuit provides high-accuracy analog I/O with autocalibration and programming library support. Dual minicard sockets and a PCIe/104 socket with PCIe x1 and x16 links (depending on the installed COM) enable feature upgrade with the widest range of I/O modules, from low-cost minicards up to high-performance graphics and 10Gb Ethernet, all without modifying the case or cables.
MIL-grade rugged power supply with MIL-STD-461, -704, and -1275 compatibility and 9-60VDC range. The supply is available with both isolated and non-isolated output configurations. As a cost and weight reduction alternative, a MIL-STD-461 filter circuit is built right into the connector board, eliminating the separate power supply for applications where 461 filtering alone is sufficient. Both the processor and power supply are direct-coupled to the enclosure for efficient conduction cooling.
System – On – Module configuration
Processor: Intel Core i5
Storage: M.2 2242/2280 size solid-state disk module with capacity up to 2TB
Wireless: Bluetooth (R) v5.0
I/O Signal interface
The total number of flexible I/O expansion pins on SPU is 110. These are provided in multiple ways to enable maximum flexibility in external wiring.
One front panel I/O connector (J6) is reserved for internal cable connection to allow easy I/O expansion without redesigning the enclosure. J6 is accessed internally with 3 latching pin headers: 2 20-pin and 1 30-pin (total 70 I/O signals available). On models with data acquisition, the 30-pin and one 20-pin connector are connected to the DAQ circuit on the Jasper SBC, and the second 20-pin connector remains available.
Another 20-pin internal connector is available leading to 20 unused pins on I/O connector J3. This can be used to combine custom I/O with existing system I/O to reduce the number of external cables needed.
Two additional 10-pin internal connectors support up to 20 additional I/O signals. These connectors are normally tied to the GPIO and Audio signals on J4 and J3 respectively, but they can be repurposed by removing the internal patch cables and connecting expansion boards to them instead.
Data bus interface
Serial communication I/O: RS-232/422/485 Hi-speed digital: HDMI, GbE, USB, 3.0, USB 2.0